Description：
LLO equipment uses advanced optical laws and LLO techniques, with excimer laser and DPSS laser schemes for different users to meet application scenarios of multiple products. It realizes selective LLO efficiently and has a high yield rate.
Benefits：
1. Support automatic loading/unloading, with improved efficiency;
2. High mass production efficiency, high availability;
3. Support different laser schemes;
4. Compatible with 4', 6' or 8' wafers
