It is used to automatically put wafers on etching and cleaning machine from wafer containers. It can be customized on demand, and achieve seamless connection with the master machine of the client.

1. Speed: 5500&11000 pcs/hr; machine customized on demand;
2. Ultra-low damage rate: ≤0.2%;
3. Multiple connection mode: can be provided with etching machine separately, or with other process machines