After N-type monocrystalline silicon wafer boron diffuses, to remove the single-sided BSG on chain conveyor, then perform chemical corrosion, polishing, etching, cleaning, drying in trough, and coupled with texturing, cleaning and drying of double-sided cells.

1. Adopt 182 transmission 6+6 and 210 transmission 5+5 compatible structure, to enhance machine stability, with little disturbance or deformation, easy to maintain;
2. Customized etching trough with liquid supply rollers for thorough cleaning and over-etching reduction;
3. Water cleaning adopts soaking+spraying+water spraying method;
4. Capacity: ≥9600 pcs/h, 10 channels 8400 pcs/tank; ≥11000 pcs/h, 10 channels & 464 pcs/tank，compatible with both 210&182